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data sheet no. pd60250 typical connection features ? floating channel designed for bootstrap operation ? fully operational to +600 v ? tolerant to negative transient voltage, dv/dt immune ? gate drive supply range from 10 v to 20 v ? undervoltage lockout ? 3.3 v, 5 v, and 15 v logic input compatible ? matched propagation delay for both channels ? outputs in phase with inputs high and low side driver product summary v offset 600 v max. i o +/- 130 ma/270 ma v out 10 v - 20 v t on/off (typ.) 160 ns/150 ns delay matching 50 ns irs2101(s)pbf description the irs2101 is a high voltage, high speed power mosfet and igbt driver with independent high-side and low- side referenced output channels. proprietary hvic and latch immune cmos technologies enable ruggedized monolithic construction. the logic input is compatible with standard cmos or lsttl output, down to 3.3 v logic. the output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. the floating channel can be used to drive an n-channel power mosfet or igbt in the high- side configuration which operates up to 600 v. www.irf.com 1 (refer to lead assignments for correct pin configuration). this diagram shows electrical connections only. please refer to our application notes and designtips for proper circuit board layout. irs2101 packages 8-lead pdip irs2101 8-lead soic irs2101s ? rohs compliant
irs2101(s)pbf www.irf.com 2 symbol definition min. max. units v b high-side floating supply voltage -0.3 625 v s high-side floating supply offset voltage v b - 25 v b + 0.3 v ho high-side floating output voltage v s - 0.3 v b + 0.3 v cc low-side and logic fixed supply voltage -0.3 25 v lo low-side output voltage -0.3 v cc + 0.3 v in logic input voltage (hin & lin) -0.3 v cc + 0.3 dv s /dt allowable offset supply voltage transient ? 50 v/ns p d package power dissipation @ t a +25 c (8 lead pdip) ? 1.0 (8 lead soi c) ? 0.625 rth ja thermal resistance, junction to ambient (8 lead pdip) ? 125 (8 lead soic) ? 200 t j junction temperature ? 150 t s storage temperature -55 150 t l lead temperature (soldering, 10 seconds) ? 300 absolute maximum ratings absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. all voltage param- eters are absolute voltages referenced to com. the thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. w c/w v c symbol definition min. max. units v b high-side floating supply absolute voltage v s + 10 v s + 20 v s high-side floating supply offset voltage note 1 600 v ho high-side floating output voltage v s v b v cc low-side and logic fixed supply voltage 10 20 v lo low-side output voltage 0 v cc v in logic input voltage (hin & lin) 0 v cc t a ambient temperature -40 125 note 1: logic operational for v s of -5 v to +600 v. logic state held for v s of -5 v to -v bs . (please refer to the design tip dt97-3 for more details). recommended operating conditions the input/output logic timing diagram is shown in fig. 1. for proper operation the device should be used within the recommended conditions. the v s offset rating is tested with all supplies biased at a 15 v differential. c v
irs2101(s)pbf www.irf.com 3 symbol definition min. typ. max. units t est conditions v ih logic ?1? input voltage 2.5 ? ? v il logic ?0? input voltage ? ? 0.8 v oh high level output voltage, v bias - v o ? 0.05 0.2 v ol low level output voltage, v o ? 0.02 0.1 i lk offset supply leakage current ? ? 50 v b = v s = 600 v i qbs quiescent v bs supply current ? 30 55 i qcc quiescent v cc supply current ? 150 270 i in+ logic ?1? input bias current ?310 v in = 5 v i in- logic ?0? input bias current ??5 v in = 0 v v ccuv+ v cc supply undervoltage positive going threshold 8 8.9 9.8 v ccuv- v cc supply undervoltage negative going threshold 7.4 8.2 9 v o = 0 v i o+ output high short circuit pulsed current 130 290 ? v in = logic ?1? pw 10 s v o = 15 v i o- output low short circuit pulsed current 270 600 ? v in = logic ?0? pw 10 s symbol definition min. typ. max. units test conditions t on turn-on propagation delay ? 160 220 v s = 0 v t off turn-off propagation delay ? 150 220 v s = 600 v t r turn-on rise time ? 70 170 t f turn-off fall time ? 35 90 mt delay matching, hs & ls turn-on/off ? ? 50 dynamic electrical characteristics v bias (v cc , v bs ) = 15 v, c l = 1000 pf and t a = 25 c unless otherwise specified. v ma v a ns static electrical characteristics v bias (v cc , v bs ) = 15 v and t a = 25 c unless otherwise specified. the v in , v th, and i in parameters are referenced to com. the v o and i o parameters are referenced to com and are applicable to the respective output leads: ho or lo. v cc = 10 v to 20 v i o = 2 ma v in = 0 v or 5 v
irs2101(s)pbf www.irf.com functional block diagram irs2101
irs2101(s)pbf www.irf.com 5 lead definitions symbol description hinlogic input for high-side gate driver output (ho), in phase linlogic input for low-side gate driver output (lo), in phase v b high-side floating supply hohigh-side gate drive output v s high-side floating supply return v cc low-side and logic fixed supply lolow-side gate drive output comlow-side return lead assignments 8 lead pdip 8 lead soic irs2101pbf IRS2101SPBF part number
irs2101(s)pbf www.irf.com 6 figure 2. switching time waveform definitions figure 1. input/output timing diagram figure 3. delay matching waveform definitions
irs2101(s)pbf www.irf.com 7 figure 6a. turn-on time vs. temperature figure 6b. turn-on time vs. supply voltage figure 7a. turn-off time vs. temperature figure 7b. turn-off time vs. supply voltage temperature (c) v bias supply voltage (v) temperature (c) v bias supply voltage (v) 0 100 200 300 400 500 -50 -25 0 25 50 75 100 125 turn-on delay time (ns) max . t y p. 0 100 200 300 400 500 10 12 14 16 18 20 turn-on delay time (ns) ma x . typ. 0 100 200 300 400 500 -50 -25 0 25 50 75 100 125 max. typ. turn-off delay time (ns) 0 100 200 300 400 500 10 12 14 16 18 20 ma x . ty p. turn-off delay time (ns) 0 100 200 300 400 500 02 46 8101214161820 input voltage (v) figure 6c. turn-on time vs. input voltage figure 7c. turn-off time vs. input voltage 0 100 200 300 400 500 0 2 4 6 8 101214161820 turn-off delay time (ns input voltage (v) max. typ . turn-on delay time (ns)
irs2101(s)pbf www.irf.com 8 0 1 2 3 4 5 6 7 8 10 12 14 16 18 20 v bias supply voltage (v) input voltage (v) 0 1 2 3 4 5 6 7 8 -50 -25 0 25 50 75 100 125 temperature ( o c) input voltage (v) figure 10a. turn-off fall time vs. temperature temperature (c) v bias supply voltage (v) figure 10b. t urn-off fall time vs. voltage figure 12a. logic "1" input voltage vs. temperature figure 12b. logic "1" input voltage vs. voltage turn-off fall time (ns) turn-off fall time (ns) figure 9a. turn-on rise time vs. temperature figure 9b. turn-on rise time vs. voltage temperature (c) v bias supply voltage (v) turn-on rise time (ns) turn-on rise time (ns) min. min. 0 50 100 150 200 -50 -25 0 25 50 75 100 125 max. typ. 0 100 200 300 400 500 -50 -25 0 25 50 75 100 125 max. typ. 0 100 200 300 400 500 10 12 14 16 18 20 max. typ. 0 50 100 150 200 10 12 14 16 18 20 max. typ.
irs2101(s)pbf www.irf.com 9 vcc supply voltage (v) figure 14a. high level output voltage vs. temperature figure 14b. high level output vs. supply voltage figure 15a. low level output voltage vs. temperature figure 15b. low level output vs.supply voltage temperature (c) 0.0 0.1 0.2 0.3 0.4 0.5 10 12 14 16 18 20 v bais supply voltage (v) high level output voltage (v) 0.0 0.1 0.2 0.3 0.4 0.5 -50 -25 0 25 50 75 100 125 temperature ( o c) high level output voltage (v) 0.0 0.1 0.2 0.3 0.4 0.5 -50 -25 0 25 50 75 100 125 temperature ( o c) l o w l e v e l o u t p u t v o l t a g e ( v ) 0 0.1 0.2 0.3 0.4 0.5 10 12 14 16 18 20 v bias supply voltage (v) l o w l e v e l o u t p u t v o l t a g e ( v ) max. typ. max. typ. max. typ. max. typ. max 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 temperature (c) temperature (c) figure 13a. logic "0" input bias current vs. temperature l o g i c " 0 " i n p u t b i a s c u r r e n t ( a ) max 0 1 2 3 4 5 6 10 12 14 16 18 20 l o g i c " 0 " i n p u t b i a s c u r r e n t ( a ) supply voltage (v) figure 13b. logic "0" input bias current vs. voltage
irs2101(s)pbf www.irf.com 10 figure 17a. v bs supply current vs. temperature figure 17b. v bs supply current vs. voltage v bs floating supply voltage (v) figure 18a. v cc supply current vs. temperature v cc supply current ( a) temperature (c) temperature (c) v cc supply current ( a) figure 18b. v cc supply current vs. voltage v cc supply voltage (v) v bs supply current ( a) 0 100 200 300 400 500 600 700 -50-250 255075100125 max. typ. 0 100 200 300 400 500 600 700 10 12 14 16 18 20 max. typ. 0 30 60 90 120 150 10 12 14 16 18 20 max . ty p. v bs supply current ( a) 0 30 60 90 120 150 -50 -25 0 25 50 75 100 125 max. typ. figure 16a. offset supply current vs. temperature offset supply leakage current ( m a) ( a) 0 100 200 300 400 500 0 100 200 300 400 500 600 max . figure 16b. offset supply current vs. voltage v b boost voltage (v) offset supply leakage current ( m a) temperature (c) 0 100 200 300 400 500 -50 -25 0 25 50 75 100 125 max.
irs2101(s)pbf www.irf.com 11 logic ?0? input current (
irs2101(s)pbf www.irf.com 12 output sink current (ma) temperature (c) figure 23a. output sink current vs. temperature figure 23b. output sink current vs. supply voltage output sink current (ma) v bias supply voltage (v) output source current (ma) figure 22a. output source current vs. temperature temperature (c) figure 22b. output source current vs. supply voltage output source current (ma) 0 100 200 300 400 500 -50-25 0 25 50 75100125 tem p erature ( o c ) 0 100 200 300 400 500 10 12 14 16 18 20 s() ( ) v bias supply voltage (v) 0 200 400 600 800 1000 -50-250 255075100125 0 200 400 600 800 1000 10 12 14 16 18 20 min. typ. min. typ. min. typ. min. typ.
irs2101(s)pbf www.irf.com 13 01601 013003 01 (ms001ab) 8 lead pdip case outlines 01602 010021 11 (ms012aa) 8 lead soic 87 5 65 d b e a e 6x h 0.25 [.010] a 6 4 3 12 4. outline conforms to jedec outline ms-012aa. notes: 1. dimensioning & toleranc ing per asme y14.5m-1994. 2. controlling dimension: millimeter 3. dimensions are shown in millimeters [inches]. 7 k x 45 8x l 8x c y footprint 8x 0.72 [.028] 6.46 [.255] 3x 1.27 [.050] 8x 1.78 [.070] 5 dimension does not include mold protrusions. 6 dimension does not include mold protrusions. mold protrusions no t to exc eed 0.25 [.010]. 7 dimension is the length of lead for soldering to a substrate. mold protrusions no t to exc eed 0.15 [.006]. 0.25 [.010] cab e1 a a1 8x b c 0.10 [.004] e1 d e y b a a1 h k l .189 .1497 0 .013 .050 basic .0532 .0040 .2284 .0099 .016 .1968 .1574 8 .020 .0688 .0098 .2440 .0196 .050 4.80 3.80 0.33 1.35 0.10 5.80 0.25 0.40 0 1.27 basic 5.00 4.00 0.51 1.75 0.25 6.20 0.50 1.27 min max millimeters in c h e s min max dim 8 e c .0075 .0098 0.19 0.25 .025 basic 0.635 basic
irs2101(s)pbf www.irf.com 1 carrier tape dimension for 8soicn code min max min max a 7 .9 0 8.1 0 0. 31 1 0 .3 18 b 3.90 4.10 0.153 0.161 c 11.70 12.30 0.46 0.484 d 5 .4 5 5.5 5 0. 21 4 0 .2 18 e 6 .3 0 6.5 0 0. 24 8 0 .2 55 f 5 .1 0 5.3 0 0. 20 0 0 .2 08 g 1 .5 0 n/a 0.059 n/a h 1 .5 0 1.6 0 0. 05 9 0 .0 62 m etr ic im p erial reel dimensions for 8soicn code min max min max a 329.60 330.25 12.976 13.001 b 20.95 21.45 0.824 0.844 c 12.80 13.20 0.503 0.519 d 1 .9 5 2.4 5 0. 76 7 0 .0 96 e 98.00 102.00 3.858 4.015 f n/a 18.40 n/a 0.724 g 14.50 17.10 0.570 0.673 h 12.40 14.40 0.488 0.566 m etr ic im p erial e f a c d g a b h n ot e : co ntrolling d imension in mm load ed ta pe feed direction a h f e g d b c tape & reel 8-lead soic
irs2101(s)pbf www.irf.com 15 ir world headquarters: 233 ansas st. el segundo california 025 tel: (310) 252105 order information 8-lead pdip irs2101pbf 8-lead soic IRS2101SPBF 8-lead soic tape & reel irs2101strpbf leadfree part marking information lead free released non-lead free released part number date code irxxxxxx yww? ?xxxx pin 1 identifier ir logo lot code (prod mode - 4 digit spn code) assembly site code per scop 200-002 p ? marking code s the soic-8 is msl2 qualified. this product has been designed and qualified for the industrial level. qualification standards can be found at www.irf.com data and specifications subject to change without notice. 11/27/2006

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